CM1426 Datasheet, PDF (11/13 Pages) California Micro Devices Corp – LCD and Camera EMI Filter Array with ESD Protection

PRELIMINARY
CM1426
Mechanical Details
CSP Mechanical Specifications
CM1426 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions are presented below.
For complete information on CSP packaging, see the
CM1426-04 Mechanical Specifications
The package dimensions for the CM1426-04 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Dim
Millimeters
Inches
Min Nom Max Min Nom Max
A1 1.915 1.960 2.005 0.0754 0.0772 0.0789
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.091 0.0110
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
California Micro Devices CSP Package Information
document.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
1234
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
OptiGuard^TM
Coating
D1
D2
SIDE
VIEW
Package Dimensions for CM1426-04
Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1426-04
CHIP SIZE (mm)
1.96 x 1.33 x 0.644
POCKET SIZE (mm)
B₀ X A₀ X K₀
2.08 x 1.45 x 0.71
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches cumulative
±^{to0le.2ramncme on tape}
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User direction of feed
Center lines
of cavity
Figure 13. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 11