WLP200 Datasheet, PDF (1/6 Pages) California Micro Devices Corp – WAFER LEVEL PACKAGE EVALUATION RC FILTER NETWORK

CALIFORNIA MICRO DEVICES
WLP200
Wafer Level Package Evaluation RC Filter Network
Features
• 6 Filters per device
• Ultra small footprint, 0.5mm pitch
• Silicon substrate
• 0.30mm Eutectic Solder Bumps
Applications
• EMI filter for Mobile Equipment
(e.g. Cellular Phones)
• Evaluation Device
Product Description
The WLP200 consists of 6 RC filters with different filter
characteristics in a wafer level package (WLP). All
I/O pins are ESD protected for contact discharges up to
8KV per the IEC1000-4-2 level 4 specification. Two
versions with different capacitor values are available.
Cellular phone application frequently demands filtering
of signals in the 800 to 2,700 MHz band. California
Micro Devices’ unique thin film Flip Chip filters provide a
minimum of –30 dB of attenuation over this frequency
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
techniques. Ground-bounce and cross-talk are mini-
mized by a die design that provides eight solder bump
contacts to the common supply connection. The solder
bump contacts are a 63/37 Sn/Pb alloy and are nomi-
nally 0.30 mm in diameter.
SCHEMATIC DIAGRAM
C1
R 50Ω
B1
C
GND
GND
D1
R 50Ω
R 50Ω
A1
C
GND
D2
R 90Ω
C
GND
A2
GND
GND
D3
R 90Ω
R 90Ω
A3
C
GND
GND
D4
R 70Ω
R 70Ω
A4
C
GND
GND
D5
R 70Ω
C
GND
A5
GND
C3 B3 C2 B2
GND ^{C5 B5 C4 B4}
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000 215 Topaz Street, Milpitas, California 95035
Tel: [phone]
Fax: [phone]
C1460800
www.calmicro.com
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