CSPRC030 Datasheet, PDF (1/3 Pages) California Micro Devices Corp – CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK

CALIFORNIA MICRO DEVICES
CSPRC030
Chip Scale Package (CSP) EMI Filter Network
Features
• Minimal Cross-Talk
• 4 Filter lines per device
• Ultra small foot print
• Silicon substrate
• 0.35mm Eutectic Solder Bumps
Applications
• Cellular Phones
• Cordless Phones
• Internet Appliances
• PDAs
• Laptop Computers
Product Description
Many portable applications frequently demand filtering
of signals in the 800-2,700MHz band. California Micro
Devices’ unique thin film Flip Chip filters provide a
minimum of –30dB of attenuation over this frequency
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
techniques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
Ground-bounce and cross-talk are minimized via a die
design that provides two solder bump contacts to the
common supply connection. The solder bump contacts
are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in
diameter.
SCHEMATIC DIAGRAM
A1
R 100Ω
A2
R 100Ω
A3
B1
C
39pF
GND
B2
C
39pF
GND
B3
A4
R 100Ω
A5
R 100Ω
GND
B4
C
39pF
GND
B5
C
39pF
GND
STANDARD VALUES
Resistor
100Ω
Absolute Tolerance R
±10%
Capacitor
39pF
Absolute Tolerance C
±20%
TCR of Resistors
±100ppm
Operating Temperature Range –40°C to 85°C
Leakage Current @ ±6V
<1µA
Power Rating/Resistor
25mW
ELECTRICAL CHARACTERISTICS
Filter R(Ω) C(pF) Fc (Note 1) Fc (Note 2)
RC
100
39
40MHz
109MHz
* Note 1: Calculated with 0Ω Source impedance and infinite Load
impedance.
* Note 2: Calculated with 50Ω Source impedance and 50Ω Load
impedance.
© 2000 California Micro Devices Corp. All rights reserved.
9/20/2000 215 Topaz Street, Milpitas, California 95035
Tel: [phone]
Fax: [phone]
C1440800
www.calmicro.com
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