MMSZ5221B Datasheet, PDF (1/4 Pages) Pan Jit International Inc. – SURFACE MOUNT SILICON ZENER DIODES

MMSZ5221B-MMSZ5260B
Surface mount zener diode
Features
• Planar die construction.
• 500mW power dissipation.
• General purpose, medium current.
• Ideally suited for automated assembly processes.
• RoHS compliant package
Applications
• Zener diode.
• Ultra-small surface mount package.
Packing & Order Information
3,000/Reel
Graphic symbol
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
MAXIMUM RATING @ Ta=25°C unless otherwise specified
Symbol
Parameter
Value
VF
Forward Voltage @ IF=10mA
0.9
PD
Power Dissipation
500
RθJA
Thermal resistance,junction to ambient air
350
TJ
Junction Temperature
150
Tstg
Storage Temperature Range
-65 to +150
Notes:
1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Tested with pulses, Tp ≤1.0ms.
Unit
V
mW
°C/W
°C
°C
Publication Order Number: [MMSZ5221B-MMSZ5260B]
© Bruckewell Technology Corporation Rev. A -2014