BZT52B2V4 Datasheet, PDF (1/5 Pages) Jiangsu Changjiang Electronics Technology Co., Ltd – ZENER DIODE

BZT52B2V4-BZT52B51
Surface mount zener diode
Features
• Planar die construction.
•“B” for ±2% tolerance.
• General purpose, medium current.
• Ideally suited for automated assembly processes.
• RoHS compliant package
Applications
• Zener diode.
• Ultra-small surface mount package.
Packing & Order Information
3,000/Reel
Graphic symbol
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Maximum Ratings (Tc=25°C unless otherwise noted)
Symbol
Parameter
VF
Forward Voltage @ IF=10mA
Value
0.9
PD
Power Dissipation
500
RθJA
Thermal resistance, junction to ambient air
305
TJ
Junction temperature
150
Tstg
Storage temperature range
-65 to +150
Notes:
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2
2. Short duration test pulse used to minimize self-heating effect.
3. When provided, otherwise, parts are provided with date code only, and type number identifications
appears on reel only.
4. f = 1KHz
Unit
V
mW
°C/W
°C
°C
Publication Order Number: [BZT52B2V4-BZT52B51]
© Bruckewell Technology Corporation Rev. A -2016