OPA2336 Datasheet, PDF (9/17 Pages) Burr-Brown (TI) – SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS microAmplifier Series

www.ti.com
PACKAGE OPTION ADDENDUM
9-Dec-2004
PACKAGING INFORMATION
Orderable Device
OPA2336E/250
OPA2336E/2K5
OPA2336EA/250
OPA2336EA/2K5
OPA2336P
OPA2336PA
OPA2336U
OPA2336U/2K5
OPA2336UA
OPA2336UA/2K5
OPA336N/250
OPA336N/3K
OPA336NA/250
OPA336NA/3K
OPA336NJ/250
OPA336NJ/3K
OPA336P
OPA336PA
OPA336U
OPA336U/2K5
OPA336UA
OPA336UA/2K5
OPA336UJ
OPA336UJ/2K5
OPA4336EA/250
OPA4336EA/2K5
OPA4336PA
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
PREVIEW
ACTIVE
ACTIVE
OBSOLETE
Package
Type
MSOP
MSOP
MSOP
MSOP
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SSOP/
QSOP
SSOP/
QSOP
PDIP
Package
Drawing
DGK
DGK
DGK
DGK
P
P
D
D
D
D
DBV
DBV
DBV
DBV
DBV
DBV
P
P
D
D
D
D
D
D
DBQ
DBQ
N
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8 250
None
CU NIPDAU Level-1-235C-UNLIM
8 2500
None
CU NIPDAU Level-1-235C-UNLIM
8 250
None
CU NIPDAU Level-1-235C-UNLIM
8 2500
None
CU NIPDAU Level-1-235C-UNLIM
8
50
None
Call TI
Level-NA-NA-NA
8
50
None
Call TI
Level-NA-NA-NA
8 100
None
CU SNPB Level-2-220C-1 YEAR
8 2500
None
CU SNPB Level-2-220C-1 YEAR
8 100
None
CU SNPB Level-2-220C-1 YEAR
8 2500
None
CU SNPB Level-2-220C-1 YEAR
5 250
None
CU NIPDAU Level-1-235C-UNLIM
5 3000
None
CU NIPDAU Level-1-235C-UNLIM
5 250
None
CU NIPDAU Level-1-235C-UNLIM
5 3000
None
CU NIPDAU Level-1-235C-UNLIM
5 250
None
CU NIPDAU Level-3-220C-168 HR
5 3000
None
CU NIPDAU Level-3-220C-168 HR
8
None
Call TI
Call TI
8
None
Call TI
Call TI
8 100
None
CU SNPB Level-2-220C-1 YEAR
8 2500
None
CU SNPB Level-2-220C-1 YEAR
8 100
None
CU SNPB Level-2-220C-1 YEAR
8 2500
None
CU SNPB Level-2-220C-1 YEAR
8 100
None
Call TI
Call TI
8 2500
None
Call TI
Call TI
16 250
None
CU NIPDAU Level-3-240C-168 HR
16 2500
None
CU NIPDAU Level-3-240C-168 HR
14
None
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
Addendum-Page 1