OPA2662 Datasheet, PDF (4/18 Pages) Burr-Brown (TI) – Dual, Wide Bandwidth OPERATIONAL TRANSCONDUCTANCE AMPLIFIER

SPECIFICATIONS (CONT)
ELECTRICAL (Full Temperature Range –40°C to +85°C)
At V_CC = ±5VDC, R_Q = 750Ω, T_A = T_MIN to T_MAX, unless otherwise noted, and configured as noted under “CONDITIONS”.
PARAMETER
CONDITIONS
OPA2662AP, AU
MIN
TYP
OTA INPUT OFFSET VOLTAGE
R_E = 50kΩ, R_C = 40Ω
Initial
12
Matching
2
OTA INPUT BIAS CURRENT
Initial
Matching
R_E = 100Ω, R_C = 40Ω
–1.9
1
–1.2
0.2
OTA TRANSCONDUCTANCE
Transconductance
I_C = 75mA, R_E = 0
580
OTA C-RATED OUTPUT
Output Voltage Compliance
I_C = ±5mA, R_E = 100Ω, R_C = 16Ω
±3.2
POWER SUPPLY
Positive Quiescent Current for both OTAs⁽⁴⁾ R_Q = 750Ω, R_E = 50kΩ, R_C = 1kΩ,
+8
+17
Both Channels Selected
MAX
±36
±7.2
5.9
1.2
610
+25
UNITS
mV
mV
µA
µA
mA/V
V
mA
PIN CONFIGURATION
Top View
+V_CC 1
B₁ 2
EN1 3
GND 4
I_Q Adjust 5
EN2 6
B₂ 7
–V_CC 8
OTA1
Logic
PTAT
Supply
Logic
OTA2
OPA2662
SOL-16/DIP
16 +V_CCOUT
15 E₁
14 C₁
13 NC
12 NC
11 C₂
10 E₂
9 –V_CCOUT
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage ........................................................................ ±6V
Input Voltage⁽¹⁾ .................................................................. ±V_CC to ±0.7V
Operating Temperature ................................................... –40°C to +85°C
Storage Temperature ..................................................... –40°C to +125°C
Junction Temperature .................................................................... +175°C
Lead Temperature (soldering, 10s) ............................................... +300°C
Digital Input Voltages (EN₁, EN₂) ............................... –0.5 to +V_CC +0.7V
NOTE: (1) Inputs are internally diode-clamped to ±V_CC.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING TEMPERATURE
NUMBER⁽¹⁾
RANGE
OPA2662AP
16-Pin Plastic DIP
180
OPA2662AU SOL-16 Surface Mount
211
–40°C to +85°C
–40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. ESD can cause damage ranging from
subtle performance degradation to complete device failure.
Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause
the device not to meet published specifications.
Burr-Brown’s standard ESD test method consists of five
1000V positive and negative discharges (100pF in series with
1.5kΩ) applied to each pin.
OPA2662
4