DAC900 Datasheet, PDF (3/16 Pages) Burr-Brown (TI) – 10-Bit, 165MSPS DIGITAL-TO-ANALOG CONVERTER

SPECIFICATIONS (Cont.)
At T_A = +25°C, +V_A = +5V, +V_D = +5V, differential transformer coupled output, 50Ω doubly terminated, unless otherwise specified.
PARAMETER
CONDITIONS
DAC900U/E
MIN
TYP
MAX
UNITS
POWER SUPPLY
Supply Voltages
+V_A
+V_D
Supply Current⁽⁶⁾
I_VA
I_VA, Power-Down Mode
I_VD
Power Dissipation
Power Dissipation, Power-Down Mode
Thermal Resistance, θ_JA
SO-28
TSSOP-28
+5V, I_OUT = 20mA
+3V, I_OUT = 2mA
+2.7
+5
+5.5
V
+2.7
+5
+5.5
V
24
30
mA
1.1
2
mA
8
15
mA
170
230
mW
50
mW
45
mW
75
°C/W
50
°C/W
NOTES: (1) At output I_OUT, while driving a virtual ground. (2) Measured single-ended into 50Ω Load. (3) Nominal full-scale output current is 32x I_REF; see Application
Section for details. (4) Reference bandwidth depends on size of external capacitor at the BW pin and signal level. (5) Typically 45µA for the PD pin, which has an
internal pull-down resistor. (6) Measured at f_CLOCK = 50MSPS and f_OUT = 1.0MHz.
ABSOLUTE MAXIMUM RATINGS
+VA to AGND ........................................................................ –0.3V to +6V
+VD to DGND ........................................................................ –0.3V to +6V
AGND to DGND ................................................................. –0.3V to +0.3V
+VA to +VD .............................................................................. –6V to +6V
CLK, PD to DGND ...................................................... –0.3V to VD + 0.3V
D0-D9 to DGND .......................................................... –0.3V to VD + 0.3V
I , I to AGND ............................................................ –1V to VA + 0.3V
OUT OUT
BW, BYP to AGND ....................................................... –0.3V to VA + 0.3V
REFIN, FSA to AGND .................................................. –0.3V to VA + 0.3V
INT/EXT to AGND ........................................................ –0.3V to VA + 0.3V
Junction Temperature .................................................................... +150°C
Case Temperature ......................................................................... +100°C
Storage Temperature ..................................................................... +125°C
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
DAC900U
"
DAC900E
"
PACKAGE
SO-28
"
TSSOP-28
"
PACKAGE
DRAWING
NUMBER
217
"
360
"
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
"
–40°C to +85°C
"
PACKAGE
MARKING
DAC900U
"
DAC900E
"
ORDERING
NUMBER⁽¹⁾
DAC900U
DAC900U/1K
DAC900E
DAC900E/2K5
TRANSPORT
MEDIA
Rails
Tape and Reel
Rails
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC900E/2K5” will get a single 2500-piece Tape and Reel.
DEMO BOARD ORDERING INFORMATION
PRODUCT
DAC900U
DAC900E
DEMO BOARD
ORDERING NUMBER
DEM-DAC90xU
DEM-DAC900E
COMMENT
Populated evaluation board without D/A converter. Order sample of desired DAC90x model separately.
Populated evaluation board including the DAC900E.
®
3
DAC900