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DAC813 Datasheet, PDF (3/11 Pages) Burr-Brown (TI) – Microprocessor-Compatible 12-BIT DIGITAL-TO-ANALOG CONVERTER
PIN DESCRIPTIONS
PIN NAME
1 +VL
2, 3 20V Range
4 BPO
5 ACOM
6
VREF OUT
7 VREF IN
8 +VCC
9 VOUT
10 –VCC
11 WR
12 LDAC
13 Reset
14 LMSB
15 LLSB
16 DCOM
17 D0
18 D1
19 D2
20 D3
21 D4
22 D5
23 D6
24 D7
25 D8
26 D9
27 D10
28 D11
DESCRIPTION
Positive supply pin for logic circuits. Connect to +VCC.
Connect Pin 2 or Pin 3 to Pin 9 (VOUT) for a 20V
FSR. Connect both to Pin 9 for a 10V FSR.
Bipolar offset. Connect to Pin 6 (VREF OUT) through
100Ω resistor or 200Ω potentiometer for bipolar
operation.
Analog common, ±VCC supply return.
+10V reference output referred to ACOM.
Connected to VREF OUT through a 1kΩ gain
adjustment potentiometer or a 500Ω resistor.
Analog supply input, nominally +12V to +15V
referred to ACOM.
D/A converter voltage output.
Analog supply input, nominally –12V or –15V
referred to ACOM.
Master enable for LDAC, LLSB, and LMSB. Must
be low for data transfer to any latch.
Load DAC. Must be low with WR for data transfer
to the D/A latch and simultaneous update of the
D/A converter.
When low, resets the D/A latch such that a Bipolar
Zero output is produced. This control overrides all
other data input operations.
Enable for 4-bit input latch of D8-D11 data inputs.
NOTE: This logic path is slower than the WR path.
Enable for 8-bit input latch of D0-D7 data inputs.
NOTE: This logic path is slower than the WR path.
Digital common.
Data Bit 1, LSB.
Data Bit 2.
Data Bit 3.
Data Bit 4.
Data Bit 5.
Data Bit 6.
Data Bit 7.
Data Bit 8.
Data Bit 9.
Data Bit 10.
Data Bit 11.
Data Bit 12, MSB, positive true.
ABSOLUTE MAXIMUM RATINGS(1)
+VCC to ACOM .......................................................................... 0 to +18V
–VCC to ACOM .......................................................................... 0 to –18V
+VCC to –VCC ............................................................................ 0 to +36V
DCOM with respect to ACOM ............................................................. ±4V
Digital Inputs (Pins 11–15, 17–28) to DCOM .................... –0.5V to +VCC
External Voltage Applied to BPO Span Resistor .............................. ±VCC
VREF OUT ........................................................... Indefinite Short to ACOM
VOUT ................................................................. Indefinite Short to ACOM
Power Dissipation .......................................................................... 750mW
Lead Temperature (soldering, 10s) ............................................... +300°C
Max Junction Temperature ............................................................ +165°C
Thermal Resistance, θJ-A:Plastic DIP and SOIC ........................ 130°C/W
Ceramic DIP ......................................... 85°C/W
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Burr-
Brown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
DAC813JP
DAC813JU
DAC813KP
DAC813KU
DAC813AU
PACKAGE
28-Pin Plastic DIP
28-Lead Plastic SOIC
28-Pin Plastic DIP
28-Lead Plastic SOIC
28-Lead Plastic SOIC
PACKAGE
DRAWING
NUMBER(1)
246
217
246
217
217
TEMPERATURE
RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
LINEARITY
ERROR, MAX
AT +25°C (LSB)
±1/2
±1/2
±1/4
±1/4
±1/2
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
GAIN
DRIFT
(ppm/°C)
±30
±30
±15
±15
±30
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
3
DAC813