DAC7621 Datasheet, PDF (3/11 Pages) Burr-Brown (TI) – 12-Bit, Parallel Input DIGITAL-TO-ANALOG CONVERTER

PIN CONFIGURATION
Top View
SSOP
CLR ¹
V_DD ²
V_OUT ³
AGND ⁴
DGND ⁵
DB11 (MSB) ⁶
DB10 ⁷
DB9 ⁸
DB8 ⁹
DB7 ¹⁰
DAC7621E
20 LOADDAC
19 CS
18 R/W
17 DB0 (LSB)
16 DB1
15 DB2
14 DB3
13 DB4
12 DB5
11 DB6
PIN DESCRIPTIONS
PIN
LABEL DESCRIPTION
1
CLR
Reset. Resets the DAC register to zero. Active
LOW. Asynchronous input.
2
V_DD
Postive Power Supply
3
V_OUT
DAC Output Voltage
4
AGND Analog Ground
5
DGND Digital Ground
6
DB11 Data Bit 11, MSB
7
DB10 Data Bit 10
8
DB9
Data Bit 9
9
DB8
Data Bit 8
10
DB7
Data Bit 7
11
DB6
Data Bit 6
12
DB5
Data Bit 5
13
DB4
Data Bit 4
14
DB3
Data Bit 3
15
DB2
Data Bit 2
16
DB1
Data Bit 1
17
DB0
Data Bit 0, LSB
18
R/W
Read and Write Control
19
CS
Chip Select. Active LOW.
20 LOADDAC Loads the internal DAC register. The DAC register
is a transparent latch and is transparent when
LOADDAC is LOW (regardless of the state of CS or
CLK).
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
V_DD to GND .......................................................................... –0.3V to 6V
Digital Inputs to GND .............................................. –0.3V to V_DD + 0.3V
V_OUT to GND ........................................................... –0.3V to V_DD + 0.3V
Power Dissipation ........................................................................ 325mW
Thermal Resistance, θ_JA ........................................................... 150°C/W
Maximum Junction Temperature .................................................. +150°C
Operating Temperature Range ...................................... –40°C to +85°C
Storage Temperature Range ....................................... –65°C to +150°C
Lead Temperature (soldering, 10s) .............................................. +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
MINIMUM
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
SPECIFICATION
TEMPERATURE
RANGE
PACKAGE
PACKAGE
DRAWING
NUMBER⁽¹⁾
ORDERING
NUMBER⁽²⁾
TRANSPORT
MEDIA
DAC7621E
±2
"
"
DAC7621EB
±1
"
"
±1
–40°C to +85°C 20-Lead SSOP
334
DAC7621E
Rails
"
"
"
"
DAC7621E/1K Tape and Reel
±1
–40°C to +85°C 20-Lead SSOP
334
DAC7621EB
Rails
"
"
"
"
DAC7621EB/1K Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are
available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7621E/1K” will get a single
1000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
®
3
DAC7621