DAC707 Datasheet, PDF (3/11 Pages) Burr-Brown (TI) – Microprocessor-Compatible 16-BIT DIGITAL-TO-ANALOG CONVERTERS

ELECTRICAL (CONT)
At T_A = +25°C, V_CC = ±15V, V_DD = +5V, and after a 10-minute warm-up, unless otherwise noted.
PRODUCT
POWER SUPPLY REQUIREMENTS
Voltage (all models): +V_CC
–V_CC
V_DD
Current (No Load, +15V Supplies)
Current Output Models: +V_CC
–V_CC
V_DD
Voltage Output Models: +V_CC
–V_CC
V_DD
Power Dissipation (±15V supplies)
Current Output Models
Voltage Output Models
TEMPERATURE RANGE
Specification: BH Grades
JP, KP, KH Grades
SH Grades
Storage: Ceramic
Plastic
DAC707JP
MIN
TYP
MAX
DAC707/708/709KH,
DAC707KP
MIN TYP
MAX
DAC707/708/
709BH, SH
MIN
TYP
MAX
+13.5
+15
+16.5
*
*
*
*
*
*
–13.5
–15
–16.5
*
*
*
*
*
*
+4.5
+5
+5.5
*
*
*
*
*
*
+16
+30
–18
–30
+5
+10
+10
+25
–13
–25
+5
+10
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
370
800
*
*
535
*
950
*
*
–25
0
+70
*
*
–55
–65
+150
–65
–60
+100
*
*
+85
+125
+150
UNITS
V
V
V
mA
mA
mA
mA
mA
mA
mW
mW
°C
°C
°C
°C
°C
*Specification same as for models in column to the left.
NOTES: (1) MSB must be inverted externally prior to DAC708/709 input. (2) Digital inputs are TTL, LSTTL, 54/74C, 54/74HC and 54/74HTC compatible over the specified
temperature range. (3) DAC708 (current-output models) are specified and tested with an external output operational amplifier connected using the internal feedback
resistor in all tests. (4) FSR means Full Scale Range. For example, for ±10V output, FSR = 20V. (5) ±0.0015% of Full Scale Range is equal to 1 LSB in 16-bit resolution,
±0.003% of Full Scale Range is equal to 1 LSB in 15-bit resolution. ±0.006% of Full Scale Range is equal to 1 LSB in 14-bit resolution. (6) Error at input code 0000_H.
(For unipolar connection on DAC708/709, the MSB must be inverted externally prior to D/A input.) (7) Adjustable to zero with external trim potentiometer. Adjusting the
gain potentiometer rotates the transfer function around the bipolar zero point. (8) With gain and zero errors adjusted to zero at +25°C. (9) Maximum represents the 3σ
limit. Not 100% tested for this parameter. (10) The bipolar worst-case code change is FFFF_H to 0000_H and 0000_H to FFFF_H. For unipolar (DAC708/709 only) it is 7FFF_H
to 8000_H and 8000_H to 7FFF_H.
PACKAGE INFORMATION
PRODUCT
PACKAGE
PACKAGE DRAWING
NUMBER⁽¹⁾
DAC707JP
28-Pin Plastic DBL Wide DIP
215
DAC707KP
28-Pin Plastic DBL Wide DIP
215
DAC707BH
28LD Side Brazed
149
Hermetic Dip
DAC707KH
28LD Side Brazed
149
Hermetic DIP
DAC707SH
28LD Side Brazed
149
Hermetic DIP
DAC708BH
24LD Side Brazed
165
Hermetic DIP
DAC708KH
24LD Side Brazed
165
Hermetic DIP
DAC708SH
24LD Side Brazed
165
Hermetic DIP
DAC709BH
24LD Side Brazed
165
Hermetic DIP
DAC709KH
24LD Side Brazed
165
Hermetic DIP
DAC709SH
24LD Side Brazed
165
Hermetic DIP
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
V_DD to COMMON ........................................................................ 0V, +15V
+V_CC to COMMON ..................................................................... 0V, +18V
–V_CC to COMMON ...................................................................... 0V, –18V
Digital Data Inputs to COMMON ..................................... –0.5V, V_DD +0.5
DC Current any input ..................................................................... ±10mA
Reference Out to COMMON ...................... Indefinite Short to COMMON
V_OUT (DAC707, DAC709) ........................... Indefinite Short to COMMON
External Voltage Applied to R_F (pin 13 or 14, DAC708) .................. ±18V
External Voltage Applied to D/A Output
(pin 1, DAC707; pin 14, DAC709) ......................................................... ±5V
Power Dissipation ........................................................................ 1000mW
Storage Temperature ..................................................... –60°C to +150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
®
3
DAC707/708/709