BUF634_12 Datasheet, PDF (3/20 Pages) Burr-Brown (TI) – 250mA HIGH-SPEED BUFFER

PIN CONFIGURATION
Top View
8-Pin Dip Package
SO-8 Surface-Mount Package
BW 1
NC 2
V_IN 3
V– 4
G=1
8 NC
7 V+
6 V_O
5 NC
NC = No Connection
ABSOLUTE MAXIMUM RATINGS
Supply Voltage ..................................................................................... ±18V
Input Voltage Range ............................................................................... ±V_S
Output Short-Circuit (to ground) ................................................. Continuous
Operating Temperature ..................................................... –40°C to +125°C
Storage Temperature ........................................................ –55°C to +125°C
Junction Temperature ....................................................................... +150°C
Lead Temperature (soldering,10s) .................................................... +300°C
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING TEMPERATURE
NUMBER⁽¹⁾
RANGE
BUF634P
BUF634U
BUF634T
BUF634F
8-Pin Plastic DIP
006
SO-8 Surface-Mount
182
5-Lead TO-220
315
5-Lead DDPAK
325
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
Top View
5-Lead
TO-220
G=1
G=1
5-Lead DDPAK
Surface Mount
12345
12345
BW V– V+
V_IN V_O
BW V– V+
V_IN V_O
NOTE: Tab electrically
connected to V–.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
®
3
BUF634