BUF05704 Datasheet, PDF (22/25 Pages) Burr-Brown (TI) – 18 - V SUPPLY MULTI - CHANNER GAMMA CORRECTION BUFFER

THERMAL PAD MECHANICAL DATA
www.ti.com
PWP (R−PDSO−G28)
THERMAL INFORMATION
This PowerPADt package incorporates an exposed thermal pad that is designed to be attached directly to an
external heatsink. When the thermal pad is soldered direct ly to the printed circuit board (PCB), the PCB can be
used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to a
ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer from
the integrated circuit (IC).
For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,
refer to Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
and Application Brief, PowerPAD Made Easy , Texas Instruments Literature No. SLMA004. Both documents are
available at www.ti.com.
The exposed thermal pad dimensions for this package are shown in the following illustration.
28
2,35
1,60
15
Exposed Thermal Pad
1
14
6,46
5,35
NOTE: All linear dimensions are in millimeters
Top View
Exposed Thermal Pad Dimensions
PPTD032
PowerPAD is a trademark of Texas Instruments