THS3112 Datasheet, PDF (2/14 Pages) Burr-Brown (TI) – LOW-NOISE, HIGH-SPEED CURRENT FEEDBACK AMPLIFIERS

THS3112
THS3115
SLOS385 – SEPTEMBER 2001
TA
0°C to 70°C
– 40°C to 85°C
SOIC-8
(D)
THS3112CD
THS3112ID
AVAILABLE OPTIONS
PACKAGED DEVICE
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
THS3112CDDA
THS3115CD
THS3112IDDA
THS3115ID
TSSOP-14
(PWP)
THS3115CPWP
THS3115IPWP
EVALUATION
MODULES
THS3112EVM
THS3115EVM
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_CC– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 mA
Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V
Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table
Operating free-air temperature, T_A: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature, T_stg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS3112 and THS3115 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
D-8
θ_JA
95°C/W^‡
TA = 25°C
POWER RATING
1.32 W
DDA
D-14
67°C/W
66.6°C/W^‡
1.87 W
1.88 W
PWP
37.5°C/W
3.3 W
‡ _{This data was taken using the JEDEC proposed high-K test PCB.}
For the JEDEC low-K test PCB, the θ_JA is168°C/W for the D-8
package and 122.3°C/W for the D-14 package.
recommended operating conditions
Supply voltage, VCC+ to VCC_–
Operating free-air temperature, TA
Shutdown pin input levels, relative to the GND pin
Dual supply
Single supply
C-suffix
I-suffix
High level (device shutdown)
Low level (device active)
MIN NOM
±5
10
0
–40
2
MAX
±15
30
70
85
0.8
UNIT
V
°C
V
2
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