REF200 Datasheet, PDF (2/15 Pages) Burr-Brown (TI) – DUAL CURRENT SOURCE/CURRENT SINK

SPECIFICATIONS
ELECTRICAL
At T_A = +25°C, V_S = 15V, unless otherwise noted.
PARAMETER
CURRENT SOURCES
Current Accuracy
Current Match
Temperature Drift
Output Impedance
Noise
Voltage Compliance (1%)
Capacitance
CURRENT MIRROR
Gain
Temperature Drift
Impedance (output)
Nonlinearity
Input Voltage
Output Compliance Voltage
Frequency Response (–3dB)
TEMPERATURE RANGE
Specification
Operating
Storage
CONDITION
Specified Temp Range
2.5V to 40V
3.5V to 30V
BW = 0.1Hz to 10Hz
f = 10kHz
T_MIN to T_MAX
I = 100µA Unless
Otherwise Noted
2V to 40V
I = 0µA to 250µA
Transfer
REF200AP, AU
MIN
TYP
MAX
±0.25
±1
±0.25
±1
25
20
100
200
500
1
20
See Curves
10
UNITS
%
%
ppm/°C
MΩ
MΩ
nAp-p
pA/√Hz
pF
0.995
40
1
25
100
0.05
1.4
See Curves
5
1.005
–25
+85
–40
+85
–40
+125
ppm/°C
MΩ
%
V
MHz
°C
°C
°C
PIN CONFIGURATION
Top View
I₁ Low 1
I₂ Low 2
Mirror Common 3
Mirror Output 4
DIP/SOIC
8 I₁ High
7 I₂ High
6 Substrate
5 Mirror Input
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS
Applied Voltage ..................................................................... –6V to +40V
Reverse Current ........................................................................... –350µA
Voltage Between Any Two Sections ................................................. ±80V
Operating Temperature ................................................... –40°C to +85°C
Storage Temperature ..................................................... –40°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
(SOIC 3s) ........................................................ +260°C
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING TEMPERATURE
NUMBER⁽¹⁾
RANGE
REF200AP
REF200AU
8-Pin Plastic DIP
8-Pin SOIC
006
–25°C to +85°C
182
–25°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book. (2) Grade designation “A”
may not be marked. Absence of grade designation indicates A grade.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
REF200
2