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OPA360 Datasheet, PDF (2/15 Pages) Burr-Brown (TI) – 3V Video Amplifier with 6dB Gain and Filter in SC70
OPA360
SB0S294C − DECEMBER 2003 − REVISED JULY 2004
www.ti.com
PRELIMINARY ORDERING INFORMATION(1)
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA360
SC70-6
DCK
−40°C to +85°C
AUW
OPA360AIDCKT Tape and Reel, 250
OPA360AIDCKR Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V
Signal Input Terminals, Voltage(2) . . . . (V−) −0.5V to (V+) + 0.5V
Current(2) . . . . . . . . . . . . . . . . . . . ±10mA
Output Short-Circuit through 75Ω to GND(3) . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . −40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +160°C
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current-limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN CONFIGURATION
OPA360
+In 1 LPF
GND 2
SAG 3
6 V+
5 Enable
4 Out
SC70−6(1)
(1) Pin 1 of the SC70-6 is determined by orienting
the package marking as indicated in the diagram.
2