English
Language : 

ADS8482 Datasheet, PDF (2/31 Pages) Burr-Brown (TI) – 18-BIT, 1-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE
ADS8482
SLAS386A – JULY 2005 – REVISED JUNE 2006
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
MODEL
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
ADS8482I
±4
MAXIMUM
DIFFERENTIAL
LINEARITY (LSB)
–1 to +1.5
ORDERING INFORMATION(1)
NO MISSING CODES PACKAGE
PACKAGE
TEMPER-ATURE
RESOLUTION (BIT)
TYPE
DESIGNATOR
RANGE
18
7x7 48 Pin
QFN
RGZ
–40°C to 85°C
ADS8482IB
±2.5
–1 to +1.5
18
7x7 48 Pin
QFN
RGZ
–40°C to 85°C
(1) For the most current specifications and package information, refer to our website at www.ti.com.
ORDERING
INFORMATION
ADS8482IRGZT
ADS8482IRGZR
ADS8482IBRGZT
ADS8482IBRGZR
TRANS-PORT
MEDIA QTY.
Tape and reel
250
Tape and reel
1000
Tape and reel
250
Tape and reel
1000
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
+IN to AGND
–IN to AGND
Voltage
+VA to AGND
+VBD to BDGND
+VA to +VBD
Digital input voltage to BDGND
Digital output voltage to BDGND
TA Operating free-air temperature range
Tstg Storage temperature range
Junction temperature (TJ max)
QFN package
Power dissipation
θJA thermal impedance
Lead temperature, soldering
Vapor phase (60 sec)
Infrared (15 sec)
VALUE
–0.4 to +VA + 0.1
–0.4 to +VA + 0.1
–0.3 to 7
–0.3 to 7
–0.3 to 2.55
–0.3 to +VBD + 0.3
–0.3 to +VBD + 0.3
–40 to 85
–65 to 150
150
(TJMax – TA)/θJA
22
215
220
UNIT
V
V
V
V
V
V
V
°C
°C
°C
°C/W
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
Submit Documentation Feedback