OPA333 Datasheet, PDF (11/18 Pages) Burr-Brown (TI) – 1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zer-PI Drift Series

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DFN PACKAGE
The OPA2333 is offered in an DFN-8 package (also known
as SON). The DFN is a QFN package with lead contacts
on only two sides of the bottom of the package. This
leadless package maximizes board space and enhances
thermal and electrical characteristics through an exposed
pad.
DFN packages are physically small, have a smaller routing
area, improved thermal performance, and improved
electrical parasitics. Additionally, the absence of external
leads eliminates bent-lead issues.
The DFN package can be easily mounted using standard
printed circuit board (PCB) assembly techniques. See
Application Note QFN/SON PCB Attachment (SLUA271)
and Application Report Quad Flatpack No-Lead Logic
Packages (SCBA017), both available for download at
www.ti.com.
The exposed leadframe die pad on the bottom of the
package should be connected to V− or left
unconnected.
OPA333
OPA2333
SBOS351 − MARCH 2006
DFN LAYOUT GUIDELINES
The exposed leadframe die pad on the DFN package
should be soldered to a thermal pad on the PCB. A
mechanical drawing showing an example layout is
attached at the end of this data sheet. Refinements to this
layout may be necessary based on assembly process
requirements. Mechanical drawings located at the end of
this data sheet list the physical dimensions for the package
and pad. The five holes in the landing pattern are optional,
and are intended for use with thermal vias that connect the
leadframe die pad to the heatsink area on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests. Even
with applications that have low-power dissipation, the
exposed pad must be soldered to the PCB to provide
structural integrity and long-term reliability.
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