BUF634 Datasheet, PDF (10/11 Pages) Burr-Brown (TI) – 250mA HIGH-SPEED BUFFER

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PACKAGE OPTION ADDENDUM
25-Oct-2005
PACKAGING INFORMATION
Orderable Device
BUF634F
BUF634F/500
BUF634FKTTT
BUF634P
BUF634T
BUF634U
BUF634U/2K5
Status ⁽¹⁾
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
PDIP
TO-220
Package
Drawing
KTT
KTT
KTT
P
KC
ACTIVE
SOIC
D
ACTIVE
SOIC
D
Pins Package Eco Plan ⁽²⁾
Qty
5
TBD
Lead/Ball Finish MSL Peak Temp ⁽³⁾
Call TI
Call TI
5 500
TBD
CU SNPB Level-3-220C-168 HR
5
50
TBD
CU SNPB Level-3-220C-168 HR
8
50
TBD
CU SNPB Level-NA-NA-NA
5
49 Green (RoHS & TAMAC2-1/2H Level-NC-NC-NC
no Sb/Br)
SN
8 100
TBD
CU NIPDAU Level-3-220C-168 HR
8 2500
TBD
CU NIPDAU Level-3-220C-168 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1