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BS616LV2018 Datasheet, PDF (1/11 Pages) Brilliance Semiconductor – Very Low Power/Voltage CMOS SRAM 128K X 16 bit
BSI Very Low Power/Voltage CMOS SRAM
128K X 16 bit
BS616LV2018
„ FEATURES
• Very low operation voltage : 2.4 ~ 3.6V
• Very low power consumption :
Vcc = 3.0V C-grade: 16mA (Max.) operating current
I -grade: 20mA (Max.) operating current
0.1uA (Typ.) CMOS standby current
• High speed access time :
-70
70ns (Max.) at Vcc = 3.0V
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE and OE options
• I/O Configuration x8/x16 selectable by LB and UB pin
„ PRODUCT FAMILY
„ DESCRIPTION
The BS616LV2018 is a high performance, very low power CMOS Static
Random Access Memory organized as 131,072 words by 16 bits and
operates from a wide range of 2.4V to 3.6V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current
of 0.1uA and maximum access time of 70ns in 3V operation.
Easy memory expansion is provided by active LOW chip
enable(CE), active LOW output enable(OE) and three-state output
drivers.
The BS616LV2018 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS616LV2018 is available in DICE form, JEDEC standard 48-pin
TSOP Type I package and 48-ball BGA package.
PRODUCT
FAM ILY
O P E R ATIN G
TE M P E R ATU R E
Vcc
RANGE
BS616LV2018DC
BS616LV2018TC
BS616LV2018AC
0 O C to +70 O C
BS616LV2018DI
BS616LV2018TI
-40 O C to +85 O C
BS616LV2018AI
„ PIN CONFIGURATIONS
2.4V ~3.6V
SPEED
(ns)
Vcc=
3.0V
70
POWER DISSIPATION
STANDBY
Operating
(ICCSB1, Max)
(ICC, Max)
Vcc=3.0V
Vcc=3.0V
0.7 uA
16 mA
70
1.5 uA
20 mA
„ BLOCK DIAGRAM
PKG TYPE
DICE
TSOP1-48
BGA-48-0608
DICE
TSOP1-48
BGA-48-0608
1
2
3
4
5
6
A
LB
OE
A0
A1
A2
N.C.
B
D8
UB
A3
A4
CE
D0
C
D9
D10
A5
A6
D1
D2
D
VSS D11 N.C.
A7
D3
VCC
E
VCC
D12
N.C.
A16
D4
VSS
F
D14
D13
A14
A15
D5
D6
G
D15 N.C. A12
A13
WE
D7
H
N.C.
A8
A9
A10
A11 N.C.
48-ball BGA top view
A8
A13
A15
Address
A16
20
1024
A14
Input
Row
A12
A7
Buffer
Decoder
A6
A5
A4
16
DQ0
.
.
Data
Input
16
Buffer
.
.
.
.
16
.
.
Data
Output
16
DQ15
Buffer
Memory Array
1024 x 2048
2048
Column I/O
Write Driver
Sense Amp
128
Column Decoder
CE
WE
OE
UB
LB
Vcc
Gnd
Control
14
Address Input Buffer
A11 A9 A3 A2 A1 A0 A10
Brilliance Semiconductor Inc. reserves the right to modify document contents without notice.
R0201-BS616LV2018
1
Revision 2.0
April 2002