BWL-2B1A01 Datasheet, PDF (2/5 Pages) BRIGHT LED ELECTRONICS CORP – InGaN Flip chip White Efficient heat transfer.

BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BWL-2B1A01
µ
Absolute maximum ratings (T_J=25Ċ)
Parameter
Symbol
Power Dissipation
P_D
DC Forward Current*¹
I_F
Peak Pulsed Forward Current*²
I_FP
LED Junction Temperature
T_J
Operating Temperature
Topr
Storage Temperature
Tstg
Reverse Voltage
V_R
Soldering Temperature (T=5 sec) Tsol
Rating
1.0
350
1.0
130
-30~120
-40~120
5
300 ± 5
Unit
W
mA
A
o_C
o_C
o_C
V
o_C
*¹Proper current derating must be followed to keep LED junction temperature (T_J) below the maximum.
*²Condition for I_FP is pulsed with 1/10 duty and 0.1msec width.
µ
Electrical & Optical Characteristics (T_J=25Ċ)
Parameter
Forward Voltage
Total Flux
Color Temperature
Reverse Current
Thermal Resistance,
Junction To Case
Viewing Angle
Chromaticity
Coordinates
Symbol
V_F
Φ_v
CCT
I_R
RǀJ-C
2θ_1/2
x
y
Condition
I_F =350mA
I_F =350mA
I_F =350mA
V_R=5V
I_F =350mA
I_F = 350mA
I_F =350mA
I_F =350mA
Min.
-
25
5000
-
-
-
-
-
Typ.
3.5
35
6500
-
15
120
0.32
0.31
Max.
4.0
-
8000
50
-
-
-
-
Unit
V
lm
K
µA
Ċ/W
degree
Ver.2.0 Page: 2 of 5