BPD-RQ03DV-1 Datasheet, PDF (1/2 Pages) BRIGHT LED ELECTRONICS CORP – SIDE- LOOK PACKAGE PIN PHOTO DIODE

BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BPD-RQ03DV-1
SIDE- LOOK PACKAGE
PIN PHOTO DIODE
z Features
1. Wide receiving angle
2. Linear response vs. irradiance
3. Fast switching time
4. Side-looking Package ideal for space
Limited applications
5. Lens Appearance: Water Clear
z Description
The BPD-RQ03DV-1 device consists
of a PIN silicon photodiode molded in
a clear epoxy package which allows
spectral response from visible to
infrared light wavelengths. The wide
receiving angle provides relatively even
reception over a large area. The
side-looking package is designed for
easy PC board mounting. This photodiode
is mechanically and spectrally matched to
BRIGHT’s GaAs and GaAlAs series of infrared
emitting diodes.
●Package Dimensions:
NOTES:
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3.Lead spacing is measured where the leads emerge from the package
4. Specifications are subject to change without notice
z Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Reverse Breakdown Voltage
Operating Temperature
Storage Temperature Range
Lead Soldering Temperature
Maximum Rating
Unit
100
mW
60V
-45℃~+85℃
-45℃~+100℃
260℃ for 5 seconds
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