BM-10EG58MD Datasheet, PDF (1/3 Pages) BRIGHT LED ELECTRONICS CORP – hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.

BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BM-10EG58MD
● Features :
● Package Dimensions :
1. 1.476 inch (37.5mm) matrix height.
2. Dot size 3.00mm.
PIN 1.
+
3. Low power requirement.
4. Excellent characters appearance.
37.50(1.476)
5. Solid state reliability.
6. Multiplex drive , column anode com.
and row cathode com.
23.40(.921)
3.0(.118)
7. Multi color available.
8. Categorized for luminous intensity.
9. Stackable vertically and horizontally.
0.50(.020)
8.00(.315)
6.30 0.5
(.248 .020)
12.7(.500)
● Description :
1. The BM-10EG58MD is a 37.5mm(1.476") Notes:
matrix height 5×8 dot matrix display.
2. This product use hi-eff red chips and
1. All dimensions are in millimeters(inches).
2. Tolerance is ±0.25mm(.01")unless otherwise
specified.
green chips, the hi-eff red chips are
3. Specifications are subject to change without
made from GaAsP on GaP substrate,
notice.
the green chips are made from GaP
on GaP substrate.
3. This product have a black face and
white dots.
4. This product doesn't contain restriction
substance, comply ROHS standard.
● Internal Circuit Diagram :
佰鴻工業股份有限公司
http://www.brtled.com
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