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BL-BX13V1F Datasheet, PDF (1/2 Pages) BRIGHT LED ELECTRONICS CORP – LED GaP/GaP Hi-Eff Green Low current requirement.
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-BX13V1F
● Features:
●Package dimensions
1. Chip material: GaP/GaP
2. Emitted color : Hi-Eff Green
4.00(.157)
3. Lens Appearance : Water Clear
4. Low power consumption.
5. High efficiency.
3.05(.120)
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
1.0(.04)
5.2(.205)
8. 3mm diameter package.
1.5(.059)
MAX.
25.4(1.0) MIN.
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
0.5(.02)
SQ. TYP.
1.0(.039) MIN.
2.54(.10)NOM.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Rating
Power Dissipation
Pd
80
Forward Current
IF
30
Peak Forward Current*1
IFP
150
Reverse Voltage
Operating Temperature
VR
Topr
5
-40℃~80℃
Storage Temperature
Tstg
-40℃~85℃
Soldering Temperature
Tsol
260℃(for 5 seconds)
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Unit
mW
mA
mA
V
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