BL-BEG202 Datasheet, PDF (1/2 Pages) BRIGHT LED ELECTRONICS CORP – Chip material: GaAsP/GaP

BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-BEG202
● Features:
●Package dimensions
1. Chip material: GaAsP/GaP (Red)
and GaP/GaP (Green)
4.00(.158)
2. Emitted color : Hi-Eff Red and Green
3. Lens Appearance : White Diffused
4. Low power consumption.
1.0(.039)
6.00(.236)
CENTER LEADS
COMMON CATHODE
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 4mm diameter package.
1.50(.059)
MAX.
0.5(.02)
SQ. TYP.
1.2 0.5
(.047 .020)
Hi-Eff Red Green
ANODE ANODE
21.0(.827) MIN.
9. This product don’t contained restriction
substance, compliance ROHS standard.
2.0(.080)MIN.
4.60(.181)
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
2.54(.100) 2.54(.100)
NOM.
NOM.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Hi-Eff Red
Green
Unit
Power Dissipation
Pd
80
80
mW
佰鴻工業股份有限公司 ^{Forward Current}
I_F
30
30
mA
Peak Forward Current*¹
I_FP
150
150
mA
Reverse Voltage
V_R
5
V
http://www.brtled.com ^{Operating Temperature}
Topr
-40℃~80℃
Storage Temperature
Tstg
-40℃~85℃
Soldering Temperature
Tsol
260℃(for 5 seconds)
*¹Condition for I_FP is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page: 1 of 2