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BL-BD1X0209 Datasheet, PDF (1/2 Pages) BRIGHT LED ELECTRONICS CORP – Chip material: AlGaAs/GaAs
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-BD1X0209
● Features:
● Package dimensions
1. Chip material: AlGaAs/GaAs (Red)
and GaP/GaP (Green)
8.0(.315)
2. Emitted color : Super Red
and Hi-Eff Green
3. Lens Appearance : White Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 3mm diameter package.
9. This product don’t contained restriction
1.5(.059)
MAX.
0.5(.02)
SQ. TYP.
2.54(.100)
NOM.
11.0(.433)
2.0(.079)
CENTER LEADS
COMMON CATHODE
Super Red
ANODE
1.0¡ Ó0.5
(.039)
21.0(.827) MIN.
Hi-Eff Green
ANODE
9.2(.362)
2.54(.100)
NOM.
2.0(.08)
MIN.
substance, compliance ROHS standard.
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Red
Green
Unit
Power Dissipation
Pd
80
80
mW
Forward Current
IF
30
30
mA
Peak Forward Current*1
IFP
150
150
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40℃~80℃
Storage Temperature
Tstg
-40℃~85℃
Soldering Temperature
Tsol
260℃(for 5 seconds)
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.
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