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BL-B45V1G Datasheet, PDF (1/2 Pages) BRIGHT LED ELECTRONICS CORP – LED GaP/GaP Hi-Eff Red Low current requirement.
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-B45V1G
● Features:
1. Chip material: GaAsP/GaP
2. Emitted color : Hi-Eff Red
3. Lens Appearance : red diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 3mm diameter package.
9. This product don’t contained restriction
substance, compliance ROHS standard.
● Package dimensions
3.05(.120)
2.9(.114)
1.8(.071)
1.5(.059)
MAX.
0.5(.02)
SQ.TYP.
5.40(.213)
25.4(1.00) MIN.
1.00(.039) MIN.
3.95(.156)
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
2.54(.100)
NOM.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Absolute maximum ratings(Ta=25℃)
Parameter
Symbol
Rating
Unit
Power Dissipation
Pd
80
mW
Forward Current
IF
Peak Forward Current*1
IFP
30
mA
150
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40℃~80℃
Storage Temperature
Tstg
-40℃~85℃
Soldering Temperature
Tsol
260℃(for 5 seconds)
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.
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