CR00201-FW-8252ELF Datasheet, PDF (7/8 Pages) Bourns Electronic Solutions – Bourns Chip Resistors and Arrays

Chip Array vs DIP Package
Chip Array
• Ceramic has protective coating on top
• Terminate to metallization on ceramic
• Low power
DIP Package
• Ceramic covered with molding
• Terminate to pins connected to ceramic
• Higher power rating than chip array
Chip Resistor and Chip Array Applications
• Test equipment
• Consumer electronics
• Appliances
• Telecommunications
• Hand-held electronics
• Office equipment
• Industrial equipment
• Small signal instrumentation
• DC/DC converters in power modules