C650-180-WH_12 Datasheet, PDF (4/6 Pages) Bourns Electronic Solutions – C650 and C850 Series TBU® High-Speed Protectors

C650 and C850 Series TBU^® High-Speed Protectors
Product Dimensions
B
A
K
J
K
J
C
E
F
E
N
3
21
H
PIN 1
TOP VIEW
Recommended Pad Layout
0.70
(.028)
2.625
(.103)
1.15
(.045)
3.55
(.140)
D
N
SIDE VIEW
BOTTOM VIEW
Pad Designation
Pad #
Apply
1
In/Out
2
NC
3
In/Out
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
Dim.
A
B
C
D
E
F
H
J
K
N
Min.
3.90
(.154)
8.15
(.321)
0.80
(.031)
0.000
(.000)
2.55
(.100)
1.10
(.043)
3.45
(.136)
0.20
(.008)
0.65
(.026)
0.20
(.008)
Typ.
4.00
(.157)
8.25
(.325)
0.85
(.033)
0.025
(.001)
2.60
(.102)
1.15
(.045)
3.50
(.138)
0.25
(.010)
0.70
(.028)
0.25
(.010)
Max.
4.10
(.161)
8.35
(.329)
0.90
(.035)
0.050
(.002)
2.65
(.104)
1.20
(.047)
3.55
(.140)
0.30
(.012)
0.75
(.030)
0.30
(.012)
DIMENSIONS:
MM
(INCHES)
TBU^® protectors have matte-tin termination finish. Suggested layout should use non-solder mask define (NSMD). Recommended stencil thick-
ness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any
power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not allow
any signal, ground or power signals beneath any of the pads of the device.
Thermal Resistances
Symbol
Rth(j-a)
Parameter
Junction to leads (package)
Value
116
Unit
°C/W
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.