MLU Datasheet, PDF (2/3 Pages) Bourns Electronic Solutions – ESD Protectors

ChipGuard^® MLU Series - ESD Protectors
Product Dimensions
L
Dimension
L
W
A
B
W
B
CG0402
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.36 ± 0.05
(0.014 ± 0.002)
0.25 ± 0.15
(0.10 ± 0.006)
A
DIMENSIONS:
MM
(INCHES)
CG0603
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.45 ± 0.10
(0.018 ± 0.004)
0.30 ± 0.20
(0.012 ± 0.008)
Recommended Pad Layout
A
Dim.
A
B
C
D
C
D
CG0402
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
B
CG0603
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
250
200
150
100
50
0
110 sec. (min.)
30-70
sec.
Time (seconds)
Cooling
120 sec. (min.)
A Stage 1 Preheat
B Stage 2 Preheat
C Stage 3 Preheat
D Main Heating
E Cooling
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
30 s to 60 s
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.