MF-USMF035-2 Datasheet, PDF (2/4 Pages) Bourns Electronic Solutions – MF-USMF Series - PTC Resettable Fuses

MF-USMF Series - PTC Resettable Fuses
Product Dimensions
Model
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175X
A
Min.
Max.
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
3.00
(0.118)
3.43
(0.135)
Packaging: 3000 pcs. per reel.
B
Min.
Max.
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
2.35
(0.093)
2.80
(0.110)
Top and Bottom View
A
Side View
C
B
D
Recommended Pad Layout
1.0 ± 0.05
(.039 ± .002)
2.0 ± 0.1
(.079 ± .004)
1.0 ± 0.05
(.039 ± .002)
2.5 ± 0.1
(.098 ± .004)
C
Min.
Max.
0.80
(0.031)
1.1
(0.043)
0.80
(0.031)
1.1
(0.043)
0.80
(0.031)
1.1
(0.043)
0.55
(0.022)
0.85
(0.033)
0.55
(0.022)
0.85
(0.033)
0.55
(0.022)
0.85
(0.033)
0.55
(0.022)
0.85
(0.033)
0.40
(0.016)
0.85
(0.033)
0.40
(0.016)
0.85
(0.033)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
DIMENSIONS:
MM
(INCHES)
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Solder Reflow Recommendations
Preheating
300
250
200
150
100
50
0
Soldering
Cooling
Notes:
• MF-USMF models cannot be wave soldered.
• If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
• Compatible with Pb and Pb-free solder reflow profiles.
• Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse^® Polymer PTC Soldering
Recommendation guidelines.
160–220
10–20
120
Time (seconds)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.