CRP1206-LF Datasheet, PDF (2/2 Pages) Bourns Electronic Solutions – High precision chip resistors

MATERIAL DECLARATION SHEET
Bismuth trioxide 1304-76-3
50
5 First encapsulating
Resin
Epoxy Resin
25036-25-3
30
0.1038
Aluminum oxide 1344-28-1
10
Boron oxide
1303-86-2
10
6
Overcoat
Resin
0.2327
Epoxy Resin
25036-25-3
100
7
Side conductor
Silver
Silver
7440-22-4
85
0.2341
Phenolic Resin 9003-36-5
15
8
Plating (Middle)
Nickel
0.1985
Nickel
7440-02-0
100
9
Plating (Outer)
Tin
0.3573
Tin
7440-31-5
100
10
Marking
Resin
Epoxy Resin
25068-38-6
70
0.0215
Titanium dioxide 1317-80-2
30
Total weight
10.0609
0.516
0.310
0.103
0.103
2.313
1.978
0.349
1.973
3.551
0.150
0.064
This Document was updated on: 1-27-2012
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemption: 7(c)-I – electrical and electronic components containing lead in a glass or ceramic...
1.032
2.313
2.327
1.973
3.551
0.214
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