CRM2512 Datasheet, PDF (2/2 Pages) Bourns Electronic Solutions – High power chip resistors

MATERIAL DECLARATION
Bismuth trioxide 1304-76-3
50
5 First encapsulating
Resin
Resin
25036-25-3
30
0.3685
Aluminum oxide 1344-28-1
10
Boron oxide
1303-86-2
10
6
Overcoat
Resin
0.8454
Resin
25036-25-3
100
7
Side conductor
Silver
0.8142
Silver
Resin
7440-22-4
85
9003-36-5
15
8
Plating (Middle)
Nickel
0.6872
Nickel
7440-02-0
100
9
Plating (Outer)
Tin
1.0308
Tin
7440-31-5
100
10
Marking
Resin
Resin
25068-38-6
70
0.0525
Titanium dioxide 1317-80-2
30
Total weight
39.8551
This Document was updated on: 10/29/2010
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemption 5 - Lead in glass of ... electronic components ... of Directive 2002/95/EC RoHS.
0.463
0.278
0.092
0.092
2.121
1.737
0.306
1.724
2.586
0.092
0.040
0.925
2.121
2.043
1.724
2.586
0.132
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