CMF-SD10 Datasheet, PDF (2/3 Pages) Bourns Electronic Solutions – Telecom CPTC Resettable Fuses

Applications
Used as a secondary overcurrent protection
device in:
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Access equipment
CMF-SD Series - Telecom CPTC Resettable Fuses
Product Dimensions
Recommended Pad Layout
A
B
H
F
G
E
DIMENSIONS:
MM
(INCHES)
D
COPLANARITY:
0.15
(.006)
C
(Reduced value available on request.)
Packaging Options - Tape and Reel:
CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400
pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
Dim.
A
B
C
D
E
F
G
H
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
9.00
(.354)
MAX.
10.80
(.425)
MAX.
10.20
(.402)
MAX.
4.88 - 5.28
(.192 - .208)
2.41 - 2.61
(.095 - .103)
0.5
(.020)
MAX.
2.5
(.098)
1.0
(.039)
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
250
200
150
100
50
0
160–220
10–20
120
Time (seconds)
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
Rework
• A device should not be reworked.
CMF-SD35A
CMF-SD50A
7.15
(.281)
MAX.
8.50
(.355)
MAX.
8.10
(.319)
MAX.
3.25 - 3.65
(.128 - .144)
2.41 - 2.61
(.095 - .103)
0.5
(.020)
MAX.
2.5
(.098)
1.0
(.039)
B
1
A
3
2
4
C
H
G
F
DE
1
2
3
4
Dim.
A
B
C
D
E
F
G
H
CMF-SD10
CMF-SD25
CMF-SD35
CMF-SD50
10.0
(.394)
8.80
(.346)
3.20
(.126)
2.00
(.079)
2.60
(.102)
5.00
(.197)
7.60
(.299)
10.0
(.394)
CMF-SD35A
CMF-SD50A
8.00
(.315)
7.05
(.278)
2.75
(.108)
2.00
(.079)
2.51
(.099)
3.45
(.136)
5.95
(.234)
8.15
(.321)
DIMENSIONS:
MM
(INCHES)
CMF-SD SERIES, REV. O, 05/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.