CMF-SD Datasheet, PDF (2/3 Pages) Bourns Electronic Solutions – Telecom CPTC Resettable Fuses

CMF-SD Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
Soldering
250
200
150
100
50
0
160–220
10–20
Time (seconds)
Cooling
120
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
Rework
• A device should not be reworked.
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www.bourns.com
CMF-SD SERIES, REV. F, 08/07
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.