CM453232-R10ML Datasheet, PDF (2/7 Pages) Bourns Electronic Solutions – High resistance to heat and humidity

CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
Packaging Specifications
CM10, CM16, CM20, CM25, CM32
t1
E
ØDo
P3
CM45
t1
E
ØDo
P3
F
W
t2
Chip
Component
B
D1
DIA.
P2
P1
A
Tape running direction
F
W
t2
Chip
Component
B
P2
P1
A
Tape running direction
Model
CM10
CM16
CM20
CM25
CM32
CM45
A
0.71 (.027)
1.00 (.039)
1.45 (.057)
2.40 (.094)
2.80 (.110)
3.60 (.142)
B
1.21 (.047)
1.80 (.071)
2.25 (.089)
2.90 (.114)
3.60 (.142)
4.90 (.193)
W
F
E
P1
8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
12.00 (.472) 5.50 (.217) 1.75 (.069) 8.00 (.315)
P2
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
P3
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
¿D0
¿D1
1.50 (.059) 0.60 (.024)
1.50 (.059) 0.60 (.024)
1.50 (.059) 1.00 (.039)
1.50 (.059) 1.10 (.043)
1.50 (.059) —
1.50 (.059) —
t1
0.27 (.011)
0.27 (.011)
0.25 (.010)
0.25 (.010)
0.25 (.010)
0.30 (.012)
t2
1.20 (.047)
1.20 (.047)
1.55 (.061)
1.85 (.073)
2.40 (.094)
3.50 (.138)
Reel Dimensions
Model
CM10
CM16
CM20
CM25
CM32
CM45
A
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
B
C
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
D
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
E
W
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 9 (.354)
2 (.079) 13 (.512)
Packaging
Model
CM10
CM16
CM20
Quantity
10000 pcs
3000 pcs
3000 pcs
Weight
150 g
90 g
90 g
Model
CM25
CM32
CM45
Quantity
2000 pcs
2000 pcs
500 pcs
Weight
100 g
190 g
100 g
E
C
B
D
A
W
Soldering
Flow Soldering
Infrared
Vapor-phase
260 °C maximum for 5 seconds (2 wave solder method)
200 °C for a maximum of 30 seconds. Peak of 240 °C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
215 °C for a maximum of 30 seconds.
Flow Soldering
10 seconds max.
260 °C
Infrared Soldering
10 seconds max.
230 °C
Preheat:
100 to 150 °C
2 minutes
min.
Preheat:
100 to 150 °C
2 minutes
min.
30 seconds max.
200 °C
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Vapor-phase Soldering
10 seconds max.
220 °C
Preheat:
100 to 150 °C
2 minutes
min.
30 seconds max.
215 °C