CG0805-MLA18KE Datasheet, PDF (2/3 Pages) Bourns Electronic Solutions – ESD Protector Array

ChipGuard^® CG0805MLA Series - ESD Protector Array
Product Dimensions
BL
L
W
X
X
P
S
Recommended Pad Layout
E
D
A
B
T
C
Dimension
L
W
T
BW
BL
P
X
S
CG0805
Series
1.25 ± 0.20
(0.049 ± 0.008)
2.00 ± 0.20
(0.080 ± 0.008)
0.90
(0.035) MAX.
0.20 ± 0.10
(0.008 ± 0.004)
0.20 ± 0.10
(0.008 ± 0.004)
0.50
(0.020)
0.75 ± 0.10
(0.029 ± 0.004)
0.25 ± 0.10
(0.009 ± 0.004)
BW
DIMENSIONS:
MM
(INCHES)
Dimension
A
B
C
D
E
CG0805
Series
0.64
(0.025)
1.27
(0.050)
1.91
(0.075)
0.28
(0.011)
0.51
(0.020)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
250
200
150
100
50
0
110 sec. (min.)
30-70
sec.
Time (seconds)
Cooling
120 sec. (min.)
A Stage 1 Preheat
B Stage 2 Preheat
C Stage 3 Preheat
D Main Heating
E Cooling
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
30 s to 60 s
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications