CG0402MLU Datasheet, PDF (2/3 Pages) Bourns Electronic Solutions – ChipGuard MLU Series - ESD Protectors Memory protection Automotive

ChipGuard^® MLU Series - ESD Protectors
Product Dimensions
L
Dimension
L
W
A
B
W
B
CG0402
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.36 ± 0.05
(0.014 ± 0.002)
0.25 ± 0.15
(0.10 ± 0.006)
A
DIMENSIONS:
MM
(INCHES)
CG0603
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.45 ± 0.10
(0.018 ± 0.004)
0.30 ± 0.20
(0.012 ± 0.008)
Recommended Pad Layout
A
Dim.
A
B
C
D
C
D
CG0402
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
B
CG0603
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
250
200
150
100
50
0
110 sec. (min.)
30-70
sec.
Time (seconds)
Cooling
120 sec. (min.)
A Stage 1 Preheat
B Stage 2 Preheat
C Stage 3 Preheat
D Main Heating
E Cooling
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
30 s to 60 s
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.