CG0201MLA-5.5MH Datasheet, PDF (2/3 Pages) Bourns Electronic Solutions – Bidirectional protection

ChipGuard^® MLA Series µVaristor ESD Clamp Protector
Product Dimensions
TOP VIEW
0.30 ± 0.05
(.012 ± .002)
SIDE VIEW
0.60 ± 0.05
(.024 ± .002)
0.20 ± 0.10
(.008 ± .004)
DIMENSIONS:
MM
(INCHES)
Construction
0.30 ± 0.05
(.012 ± .002)
Recommended Pad Layout
0.25 ± 0.05
(.010 ± .002)
0.30 ± 0.05
(.012 ± .002)
0.25 ± 0.05
(.010 ± .002)
0.30 ± 0.05
(.012 ± .002)
Solder Reflow Recommendations
TP
TL
TSmax
TSmin
TP
RAMP-UP
TL
CRITICAL ZONE
TLTO TP
A Stage 1 Preheat
Ramp
B Stage 2 Preheat
C Stage 3 Preheat
to Main Heating
Ambient to Preheating
Temperature
Preheat min./max.
Temperature Range
Max. Time Above
Stated Temperature
TS
PREHEAT
RAMP-DOWN
25
t 25 °C TO PEAK
Time (seconds)
D Main Heating
E Cool Down
Max. Time Within 5 °C
of Peak Temperature
(260 °C)
Rate from Peak
Temperature
CAUTION:
• Rapid heating and cooling in excess of stated maximum rates will easily damage this product.
• Locating heating can also damage product.
• Do not thermally shock product in excess of 100 °C.
• Product can be repaired using a 30 W or less solder gun/iron. Tip temperature maximum is 280 °C for less than 3 seconds.
• Do not touch the component directly with the soldering gun/iron.
• Excess soldering volumes can damage the body of the product.
3 °C / s max.
150 °C to 200 °C
60 s to 180 s
217 °C
60 s to 150 s
255 °C
20 s to 40 s
6 °C / s max.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.