CC453232 Datasheet, PDF (2/2 Pages) Bourns Electronic Solutions – Wirewound Chip Inductor

SCRCF405530243S2eSreierise-sL-iWneirFeiwltoeurnd Chip Inductor
Solder Reflow Profile
Temperature
Rising Area
2 ~ 4 °C/sec.
250
200
150
100
50
Preheat Area
150 ~ 180 °C / 90 - 150 sec.
Reflow Area
2 ~ 4 °C/sec.
Forced Cooling Area
3 ~ 5 °C/sec.
10 sec.
30 sec.max.
(20~30 sec.)
240 ±5 °C
0
50
100
150
200
250
Time (Seconds)
Peak Temperature: 245 ° max.
Maximum Time Above 225 °C: 30 seconds
Maximum Time Above 200 °C: 50 seconds
Packaging Specifications
178
(7.008)
DIA.
2.0 ± 0.5
(.079 ± .020)
16.5
(.650)
DIMENSIONS:
MM
(INCHES)
21.0 ± 0.8
(.827 ± .031)
13.0
(.512)
DIA.
13.0
(.512)
DIA.
50.0 -0
(1.97 -0)
14.0 +0
(0.551 +0)
8
4
END
(.315)
(.157)
COVER
TAPE
EMBOSSED
CAVITY
EMBOSSED
CARRIER
12.0
(.472)
START
NO COMPONENT
200
(7.87)
MIN.
COMPONENTS
USER DIRECTION OF FEED
QTY: 500 PCS. PER REEL
REV. 09/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
NO COMPONENT
400
(15.75)
MIN.