4614X Datasheet, PDF (2/2 Pages) Bourns Electronic Solutions – Thick Film Conformal SIP

MATERIAL DECLARATION
Epoxy resin
25068-38-6
30
Silicon dioxide
14808-60-7
45
7
Encapsulation
Molding
compound
0.31416 ^{Non-halogen flame}
retardant
proprietary
17
Pigment
13463-67-7
4531-49-1
8
Total weight 0.7322
This Document was updated on: July 7, 2011
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemptions: 7(c)-I Electrical and electronic components containing lead in a glass or ceramic...
12.872
19.308
7.294
3.433
42.906
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