1800 Datasheet, PDF (2/2 Pages) C&D Technologies – Axial Lead Inductors

1800 Series – Signal and Dataline Protector
Typical Connections
Unbalanced Interface, Two Individual Circuits, Such as RS-233
BLDG. 1
BLDG. 2
XMTR
RCVR
E2 ^{P/N 1810} L2
E3
L3
E1 ^GND L1
L2 ^{P/N 1810} E2
L3
E3
L1 ^GND E1
RCVR
XMTR
How To Order (Clamp)
Add -A1 to base model number for
DIN-1 clamp.
(Example: 1810-10-A1)
FEED-THRU(E3/L3)
GROUNDING SCREW
EQPT. COMMON
AND/OR GND.
COMMON
GND.
COMMON
GND.
Balanced or Differential Interface, Such as RS-422
BLDG. 1
BLDG. 2
EQPT. COMMON
AND/OR GND.
XMTR
E2 ^{P/N 1820} L2
E3
L3
E1 ^GND L1
L2 ^{P/N 1820} E2
L3
E3
L1 ^GND E1
RCVR
EQPT. COMMON
AND/OR GND.
COMMON
GND.
COMMON
GND.
EQPT. COMMON
AND/OR GND.
Current Loop, 4-20 mA
CONTROL ROOM
POWER
SUPPLY
I
250
OHMS
I
RECEIVER
File No.
1-5 VOLTS
1800SERS3
E2 ^{P/N 1820} L2
E3
L3
E1 ^GND L1
COMMON
GND.
RED
BOURNS
1669
BLK
RED/WHITE
BLACK /WHITE
GREEN
BOURNS
PROTECTOR
P/N 1669
XMTR
Grounding: The 8-32 mounting screw and attached clamp, and hence the DIN-1 (TS-32)
or DIN-3 (TS-35) rail, serve as the protector ground. The rail (or 8-32 mounting screw if the
clamp is not used) should be connected to the facility ground via an AWG #6 or larger copper
wire. This wire should be as short and straight as possible. Single point grounding will provide
better protection and will permit the protector to be located a distance from the equipment.
Product Dimensions
DIN-1 RAIL
(TS-32/EN50035)
28.96
(1.14)
49.02
(1.93)
Add -A3 to base model number for
DIN-3 clamp.
(Example: 1810-10-A3)
MOUNTING/GROUNDING SCREW
45.47
(1.79)
DIN-3 RAIL
(TS-35/EN50022)
DIMENSIONS:
MM
(INCHES)
GND
48.51
(1.91)
E3/L3 GROUNDING LINK
83.31
(3.28)
18.80
(0.74)
3.18
(0.125)
2.36
(0.093)
ALIGNMENT PIN
DIMENSIONS:
MM
(INCHES)
8-32UNF-2A
17.80
(0.70)
9.53
(0.375)
REV. I 01/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.