TISP1120F3D Datasheet, PDF (1/5 Pages) Bourns Electronic Solutions – DUAL FORWARD-CONDUCTING UNIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTOR

*RoHS ^COMPLIANT
TISP1120F3D
DUAL FORWARD-CONDUCTING UNIDIRECTIONAL
THYRISTOR OVERVOLTAGE PROTECTOR
TISP1120F3D Overvoltage Protector
Ion-Implanted Breakdown Region
- Precise and Stable Voltage
Planar Passivated Junctions
- Low Off-State Current <10 µA
Low Voltage Overshoot Under Surge
Device Name
TISP1120F3D
V_DRM
V
-97
Rated for International Surge Wave Shapes
Wave Shape
2/10
8/20
10/160
10/700
10/560
10/1000
Standard
GR-1089-CORE
IEC 61000-4-5
TIA-968-A
ITU-T K.20/21/45
TIA-968-A
GR-1089-CORE
V_(BO)
V
-120
I_PPSM
A
120
70
60
50
45
35
8-SOIC Package (Top View)
T1
NC 2
8G
7G
NC 3
R4
6G
5
G _{MDXX AEB}
NC - No internal connection
Device Symbol
T
R
G ^SD1XAAa
Description
This dual forward-conducting unidirectional overvoltage protector is designed for the overvoltage protection of ICs used for the SLIC
(Subscriber Line Interface Circuit) function. The IC line driver section is typically powered with 0 V and a negative supply. The TISP1120F3D
limits voltages that exceed these supply rails.
High voltages can occur on the line as a result of exposure to lightning strikes and a.c. power surges. Negative transients are initially limited by
breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar. The high crowbar holding current helps
prevent d.c. latchup as the current subsides. Positive transients are limited by diode forward conduction. These protectors are designed to
suppress and withstand the listed international lightning surges on any terminal pair.
This monolithic protection device is fabricated in an ion-implanted planar structure to ensure precise and matched breakover control, and is
virtually transparent to the system in normal operation.
How to Order
Device
Package
Carrier
TISP1120F3D 8-SOIC Embossed Tape Reeled
Order As
Marking Code Standard Quantity
TISP1120F3DR-S
1120F3
2500
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
JULY 2005 – REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.