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SXT6A-3-5SA Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – SIP Non-Isolated Power Module
*RoHS COMPLIANT
Features
■ SIP (Single In-line Package)
■ Low output ripple and noise
■ Output voltage programmable from
0.75 Vdc to 3.6 Vdc via external resistor
■ 6 A output current
■ Up to 96 % efficiency
■ High reliability
■ Remote on/off
■ Output overcurrent protection
(non-latching)
■ Small size, low profile
■ Sequencing function
■ Cost-efficient
SXT6A-3-5SA SIP Non-Isolated Power Module
Description
Bourns® SXT6A-3-5SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features
such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter
INPUT
Voltage
Current
Remote ON/OFF:
Low or Open =
High =
Standard
On
Off
-P Option
Off
On
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
Ripple (pk-pk) (20 MHz Bandwidth)
Ripple (rms)
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
GENERAL
MTBF
Operating Temperature
Storage Temperature
Switching Frequency
Efficiency
(Vin = 5.0 Vdc, TA= 25 °C, Full Load)
Min. Nom. Max.
Units
Notes
2.4
5.5
Vdc
Vin (min) = Vo + 0.5 V, Vo > 1.9 V
6.0
Adc
0.4
Vdc
2.4
Vin
Vdc
10 µA max.
1 mA max.
0.75
3.63
Vdc
0.0
6.0
Adc
-2.0
2.0
% Vo,set
0.3
% Vo,set
0.4
% Vo,set
0.4
% Vo,set
40
50
mVpk-pk 1 µF ceramic//10 µF tantalum capacitors
10
15
mVrms 1 µF ceramic//10 µF tantalum capacitors
130
mV
1 µF ceramic//10 µF tantalum capacitors
25
µs
50
50
mV
µs
2 x 150 µF polymer Capacitors
10,000
-40
+85
-55
+125
300
81.0
87.0
89.0
90.0
93.0
95.0
kHrs
°C
°C
kHz
%
%
%
%
%
%
Vo,set = 0.75 Vdc
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Applications
■ Intermediate Bus architecture
■ Distributed power applications
■ Workstations and servers
■ Telecom equipment
■ Enterprise networks including LANs/WANs
■ Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.