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SRU1063 Datasheet, PDF (1/2 Pages) Bourns Electronic Solutions – Shielded SMD Power Inductors
*Ro*HRSoCHOSMCPOLMIAPNLITANT
100
Features
■ Maximum height of 6.7 mm
■ Current up to 5.5 A
■ Lead free
■ RoHS compliant*
Applications
■ Input/output of DC/DC converters
■ Power supplies for:
• Portable communication equipment
• Camcorders
• LCD TVs
• Car radios
SRU1063 Series - Shielded SMD Power Inductors
Electrical Specifications
Bourns Part No.
Inductance 100 KHz Q
(µH)
Tol. % Ref.
Test
Frequency
(MHz)
SRF
Typ.
(MHz)
RDC
Max.
(mΩ)
I rms
Max.
(A)
I sat
Typ.
(A)
SRU1063-4R7Y 4.7
± 30 11
7.96
30
14
5.50 5.70
SRU1063-100Y
10
± 30 14
2.52
18
38
3.80 4.00
SRU1063-150Y
15
± 30 12
2.52
14
42
3.20 3.40
SRU1063-220Y
22
± 30 15
2.52
10
60
3.00 3.20
SRU1063-330Y
33
± 30 12
2.52
8
105 2.20 2.40
SRU1063-470Y
47
± 30 10
2.52
6
150 1.40 1.60
SRU1063-680Y
68
± 30
8
2.52
5
210 1.20 1.35
SRU1063-101Y 100
± 30 12
2.52
4
320 1.10 1.20
Electrical Schematic
Recommended Layout
REF.
1.80
(.071)
1.80
(.071)
REF.
7.20
(.283)
REF.
1.80
(.071)
REF.
7.20
(.283)
REF.
1.80
(.071)
REF.
3.80
(.150)
REF.
3.80
(.150) REF.
General Specifications
Test Voltage.....................................0.1 V
Reflow Soldering ...230 °C, 50 sec. max.
Operating Temperature ..-40 °C to +125 °C
(Temperature rise included)
Storage Temperature..-40 °C to +125 °C
Resistance to Soldering Heat
................................260 °C for 10 sec.
Materials
Core.....................Ferrite DR and RI core
Wire .............................Enameled copper
Terminal ....................................Ag/Ni/Sn
Rated Current
....................Ind. drop 35 % typ. at Isat
Temperature Rise
......................40 °C max. at rated Irms
Packaging.....................500 pcs. per reel
Product Dimensions
10.0 ± 0.30
(.394 ± .012)
10.0 ± 0.30
(.394 ± .012)
6.50 ± 0.30
(.256 ± .012)
7.90 TYP.
(.311)
3.30
(.130)
TYP.
3.40
(.134)
TYP.
3.30
(.130)
TYP.
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.