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SF-0603F050-2 Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – Fast Acting Surface Mount Fuses
*RoHS COMPLIANT
SinglFuse™ SF-0603F Series Features
■ Single blow fuse for overcurrent
protection
■ Surface mount packaging for automated
assembly
■ 1608 (EIA 0603) miniature footprint
■ Fast-acting fuse
■ UL listed
■ RoHS compliant* and halogen free**
■ Thin film chip fuse
SF-0603F Series - Fast Acting Surface Mount Fuses
Electrical Characteristics
Model
Rated Current
(Amps)
Fusing Time
Resistance
(mΩ) Typ.***
SF-0603F050
0.50
250
SF-0603F063
SF-0603F080
SF-0603F100
SF-0603F125
SF-0603F150
SF-0603F160
SF-0603F200
SF-0603F250
SF-0603F300
SF-0603F315
SF-0603F400
SF-0603F500
0.63
173
0.80
115
1.00
88
1.25
63
1.50
Open within 1 min.
45
1.60
at 200 % rated
42
2.00
current
33
2.50
24
3.00
21
3.15
19
4.00
15
5.00
12
***Resistance value was measured with less than 10 % of rated current.
Rated Voltage Breaking Capacity
DC 50 V
DC 50 V
50 A
DC 32 V
DC 32 V
50 A
DC 24 V
DC 32 V
DC 24 V
50 A
DC 32 V
50 A
Typical
I2t (A2s)
0.005
0.007
0.014
0.016
0.027
0.037
0.041
0.044
0.055
0.082
0.089
0.239
0.433
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................ ±20 %.........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 %.........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance................................. 10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
How to Order
Represents total content. Layout may
vary.
SF - 0603 F 050 - 2
SinglFuse™
Asia-Pacific:
Product Designator
Tel: +886-2 2562-4117
RATING CURRENT (A)
F = 0.50 S = 2.00
I = 0.63 T = 2.50
K = 0.80 3 = 3.00
L = 1.00 U = 3.15
M = 1.25 W = 4.00
P = 1.50 Y = 5.00
N = 1.60
SMD Footprint
1608 (EIA 0603) size
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-500 (500 mA - 5.00 A)
Packaging Type
- 2 = Tape & Reel (5,000 pcs./reel)
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
* RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
** Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.