SF-0402F050-2 Datasheet, PDF (1/4 Pages) Bourns Electronic Solutions – SF-0402F Series - Fast Acting Surface Mount Fuses

*RoHS ^COMPLIANT
SinglFuse^™ SF-0402F Series Features
■ Single blow fuse for overcurrent
protection
■ Surface mount packaging for automated
assembly
■ 1005 (EIA 0402) miniature footprint
■ Fast-acting fuse
■ UL listed
■ RoHS compliant* and halogen free**
■ Thin film chip fuse
SF-0402F Series - Fast Acting Surface Mount Fuses
Electrical Characteristics
Model
SF-0402F050
SF-0402F075
SF-0402F080
SF-0402F100
SF-0402F125
SF-0402F150
SF-0402F160
SF-0402F200
SF-0402F250
SF-0402F300
SF-0402F315
SF-0402F400
Rated Current
(Amps)
0.50
0.75
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
Fusing Time
Open within 1
min. at 200 %
rated current
Resistance
(mΩ) Typ.***
320
110
120
90
67
51
46
33
25
20
19
16
Rated
Voltage
DC 24 V
Breaking
Capacity
DC24 V 35 A
Typical
I²t (A²s)
0.00317
0.0049
0.00532
0.00724
0.01344
0.01356
0.01672
0.01983
0.03763
0.05427
0.06304
0.0896
***Resistance value was measured with less than 10 % of rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................ ±20 %.........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 %.........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance................................. 10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
Represents total content. Layout may
vary.
RATING CURRENT (A)
F = 0.50 N = 1.60
V = 0.75 S = 2.00
K = 0.80 T = 2.50
L = 1.00 3 = 3.00
M = 1.25 U = 3.15
P = 1.50 W = 4.00
How to Order
SF - 0402 F 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1005 (EIA 0402) size
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-400 (500 mA - 4.00 A)
Packaging Type
- 2 = Tape & Reel (10,000 pcs./reel)
Asia-Pacific:
Tel: [phone]
Fax: [phone]
Europe:
Tel: [phone]
Fax: [phone]
The Americas:
Tel: [phone]
Fax: [phone]
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.