PM1008 Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – High Q Chip Inductors

*RoHS ^COMPLIANT
Features
■ Formerly J.W.Miller model
■ 1008 size
■ Available in E12 series
■ High Q up to 60 typ.
■ High operating temperature of 125 °C
■ Lead free
■ RoHS compliant*
Applications
■ Mobile phones
■ Cellular phones
■ CTV, VCR, HIC, FDD
PM1008 Series - High Q Chip Inductors
Electrical Specifications
Bourns Part No.
PM1008-10NM-RC
PM1008-12NM-RC
PM1008-15NM-RC
PM1008-18NM-RC
PM1008-22NM-RC
PM1008-27NM-RC
PM1008-33NM-RC
PM1008-39NM-RC
PM1008-47NM-RC
PM1008-56NK-RC
PM1008-68NK-RC
PM1008-82NK-RC
PM1008-R10K-RC
PM1008-R12K-RC
PM1008-R15K-RC
PM1008-R18K-RC
PM1008-R22K-RC
PM1008-R27K-RC
PM1008-R33K-RC
PM1008-R39K-RC
PM1008-R47K-RC
PM1008-R56K-RC
PM1008-R68K-RC
PM1008-R82K-RC
PM1008-1R0K-RC
PM1008-1R2K-RC
PM1008-1R5K-RC
PM1008-1R8K-RC
PM1008-2R2K-RC
PM1008-2R7K-RC
PM1008-3R3K-RC
PM1008-3R9K-RC
PM1008-4R7K-RC
PM1008-5R6K-RC
PM1008-6R8K-RC
PM1008-8R2K-RC
PM1008-100K-RC
Inductance
nH
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
Tol. %
±20
±20
±20
±20
±20
±20
±20
±20
±20
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
Test Frequency (MHz)
Q
Min. L
Q
50 100
500
50 100
500
40 100
350
50 100
350
55 100
350
55 100
350
60 100
350
60 100
350
60 100
350
60 100
350
60 100
350
60 100
350
60 100
350
50
25
100
45
25
100
45
25
100
45
25
100
45
25
100
45
25
100
45
25
100
45
25
100
45
25
100
45
25
100
45
25
100
25
25
50
25
7.9
7.9
25
7.9
7.9
25
7.9
7.9
25
7.9
7.9
22
7.9
7.9
22
7.9
7.9
20
7.9
7.9
18
7.9
7.9
18
7.9
7.9
18
7.9
7.9
18
7.9
7.9
18
2.5
7.9
SRF
Min.
(MHz)
4100
3300
2500
2500
2400
1600
1600
1500
1500
1300
1300
1000
1000
950
850
750
700
600
570
500
450
415
375
350
290
250
200
160
160
70
55
48
43
40
25
25
40
RDC
(Ω)
0.08
0.08
0.08
0.10
0.10
0.10
0.10
0.10
0.10
0.12
0.15
0.18
0.18
0.20
0.22
0.33
0.45
0.75
0.90
1.20
1.19
1.33
1.47
1.61
1.75
2.00
2.30
2.60
2.80
1.70
1.90
2.10
2.30
4.90
6.00
8.00
4.20
I rms
Max.
(mA)
600
600
500
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
400
470
400
400
360
330
280
280
270
250
195
185
180
175
180
150
100
200
Packaging Specifications
178.0
(7.00)
DIA.
2.0 ± 0.5
(.079 ± .020)
12.5
(.492)
21.0 ± 0.8
(.827 ± .031)
13.0 ± 0.5
(.512 ± .020)
DIA.
50.0
(1.969)
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
13.0 ± 0.5
(.512 ± .020)
DIA.
10.0
(.393)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
EMBOSSED
CARRIER
8.0
(.315)
General Specifications
Temperature Rise
.................40 ˚C max. at rated current
Operating Temperature
............................... -40 °C to +125 °C
Storage Temperature
............................... -40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
...............................260 ˚C, 5 seconds
Materials
Core Material
-10NM thru -R82K ................ Ceramic
-1R0K thru -100K......................Ferrite
Wire .......Enamelled Copper (1W1E180)
Terminal .......................... Mo/Mn+Ni+Au
Packaging.................. 2,000 pcs per reel
Product Dimensions
0.5
(.020)
1.6 ± 0.2
(.062 ± .008)
2.50 ± 0.2
(.098 ± .008)
2.0 ± 0.2
(.079 ± .008)
0.5
(.020)
0.5
(.020)
Recommended Layout
REF.
0.65
(.026)
0.65
(.026)
REF.
REF.
1.20
(.047)
2.3
(.091)
REF.
DIMENSIONS:
MM
(INCHES)
REV. 10/08