P850-G120-WH Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – MATERIAL DECLARATION SHEET

MATERIAL DECLARATION SHEET
Material Number
P850-G120-WH
Product Line
TBU
Compliance Date January-2008
RoHS Compliant
Yes
MSL
3
No.
Construction
Element(subpart)
Homogeneous
Material
1
Semiconductor
Device
Silicon Chip
Material
weight
[mg]
3.75
2
Lead Frame
Copper alloy with
silver plating
41.48
3
Bond wire
4
Die Attach
Gold wire
Adhesive
0.43
0.79
5
Mold compound
(halogen-free)
Epoxy resin
6
Matte tin plating
matte tin
40.11
2.78
Homogeneous
Material\
Substances
CASRN
if applicable
Doped silicon
7440-21-3
Copper
Iron
Tin
Zinc
Silver (plating)
Gold
Di-ester resin
Functionalized ester
Polymeric compound
Silver
Silica fused
Epoxy resin
Phenolic resin
Carbon black
Tin
7440-50-8
7439-89-6
7440-31-5
7440-66-6
7440-22-4
7440-57-5
proprietary
proprietary
proprietary
7440-22-4
60676-86-0
proprietary
proprietary
1333-86-4
7440-31-5
Total weight 89.34
This Document was updated on: January 12, 2010
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
Materials
Mass %
100
95.645
2.185
0.034
0.135
2.0
100
3
7
3
87
90.5
4.7
4.7
0.1
100
Material
Subpart
Mass % of mass of total
total unit wt.
wt. (%)
4.2
4.2
44.41
1.01
0.02
0.06
0.93
0.48
0.03
0.06
0.03
0.76
40.63
2.11
2.11
0.05
3.11
46.43
0.48
0.88
44.9
3.11
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