P500-G200-WH Datasheet, PDF (1/1 Pages) Bourns Electronic Solutions – MATERIAL DECLARATION SHEET

MATERIAL DECLARATION SHEET
Material Number
P500-G200-WH
Product Line
TBU
Compliance Date January-2008
RoHS Compliant
Yes
MSL
3
No.
Construction
Element(subpart)
Homogeneous
Material
1
Semiconductor
Device
Silicon Chip
2
Lead Frame
Copper alloy with
silver plating
3
Bond wire
4
Die Attach
Gold wire
Adhesive
5
Mold compound
(halogen-free)
Epoxy resin
6
Matte tin plating
matte tin
Material
weight
[mg]
2.04
25.11
0.4
0.73
32.29
1.95
Homogeneous
Material\
Substances
CASRN
if applicable
Doped silicon
7440-21-3
Copper
Chromium III
Tin
Zinc
Silver (plating)
Gold
Di-ester resin
Functionalized ester
Polymeric compound
Silver
Silica fused
Epoxy resin
Phenolic resin
Carbon black
Tin
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-57-5
proprietary
proprietary
proprietary
7440-22-4
60676-86-0
proprietary
proprietary
1333-86-4
7440-31-5
Total weight 62.52
This Document was updated on: January 12, 2010
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
Materials
Mass %
100
97.29
0.25
0.25
0.22
2.0
100
3
7
3
87
90.5
4.7
4.7
0.1
100
Material
Subpart
Mass % of mass of total
total unit wt.
wt. (%)
3.26
3.26
39.07
0.1
0.1
0.09
0.8
0.64
0.035
0.08
0.035
1.02
46.74
2.43
2.43
0.05
3.12
40.16
0.64
1.17
51.65
3.12
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